Hong Kong Monetary Authority to reopen 7-year HK$1.25 billion government bond tender on Nov. 11

The Hong Kong Monetary Authority announced on Nov. 5, 2026 that it will reopen a tender for an additional HK$1.25 billion of 7-year Hong Kong dollar SAR government institutional bonds (ISIN 07GB3302001) under the Infrastructure Bond Programme. The tender will take place on Nov. 11, 2026, with settlement on Nov. 12, 2026. The bonds mature on Feb. 7, 2033, carry an annual coupon of 2.91 percent paid semi-annually, and had an indicative price of 96.53 and annualized yield of 3.563 percent on Nov. 5, 2026. Bidding is restricted to primary market dealers appointed under the programme, with a minimum bid of HK$50,000 or integer multiples. Results are expected by 3 p.m. on the tender date on the HKMA website, the Hong Kong Government Bond website, Bloomberg (GBHK <GO>), and Refinitiv (IBPGSBPINDEX). Successful bidders must pay accrued interest of HK$394.64 per HK$50,000 minimum bid on the issue date. The bonds are expected to trade on the Hong Kong Stock Exchange under stock code 4201 and be fungible with existing bonds, with proceeds used for infrastructure projects under the Infrastructure Bond Framework.